1. 2. 3. material content data sheet sales product name bsf035ne2lq issued 29. august 2013 ma# MA001050858 package mg-wdson-2-3 weight* 49.04 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.497 3.05 3.05 30531 30531 leadframe non noble metal copper 7440-50-8 45.114 92.01 92.01 919943 919943 leadfinish non noble metal nickel 7440-02-0 0.115 0.23 2339 noble metal silver 7440-22-4 0.456 0.93 1.16 9302 11641 plating non noble metal nickel 7440-02-0 0.077 0.16 0.16 1580 1580 glue plastics epoxy resin - 0.091 0.18 1846 noble metal silver 7440-22-4 0.556 1.13 1.31 11337 13183 solder non noble metal copper 7440-50-8 0.005 0.01 106 noble metal silver 7440-22-4 0.031 0.06 638 non noble metal tin 7440-31-5 1.006 2.05 2.12 20510 21254 passivation plastics epoxy resin - 0.092 0.19 0.19 1868 1868 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
